含銅類鑽碳塗層電極對電燒刀熱損傷和組織沾黏之影響

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Taipei Medical University Institutional Repository > 口腔醫學院 > 醫療器材產業碩士專班 > 博碩士論文 > Item 987654321/54193

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題名:	含銅類鑽碳塗層電極對電燒刀熱損傷和組織沾黏之影響 Cu doped DLC coating electrode subatrate for electrosurgery thermal damage and tissue sticking effect
作者:	阮耀陞 RUAN, YAU-SHENG
關鍵詞:	電燒刀;組織沾黏;熱損傷;含銅類鑽碳塗層;electrosurgery;tissue sticking;thermal injury;cupper-doted diamond-like carbon
日期:	2013-01-12
上傳時間:	2018-11-19 11:13:47 (UTC+8)
摘要:	電燒儀器使用時所引起煙霧、組織沾黏和熱損傷為電燒刀使用期間最重要的議題。以含銅類鑽碳塗層電極將產生較少的組織沾黏和血液貼附，同時熱損傷溫度也明顯低於未改質處理之電極。因此推估，含銅類鑽碳塗層電極也會較未改質處理之電極引起總量較小的熱損傷區、橫向熱損傷區、纖維組織區和擁有較快的組織恢復過程，透過Western blot分析發現其含銅類鑽碳塗層電極較未改質處理電極的組織出現較少的NF-κB, caspase-3和MMP-9等發炎反應。本研究表示含銅類鑽碳塗層處理將有效增進電燒刀系統使用時的表現。 Surgical smoke, tissue sticking, and thermal injury are major concerns during electrosurgery. The Cu-DLC-electrodes generate a less amount of sticking tissues and adhesive blood cells. Thermography revealed the surgical temperature in liver tissue from the Cu-DLC-electrode was significantly lower than the SS-electrode. Moreover, Cu-DLC-electrodes caused a relatively smaller total injury area, lateral thermal injury area, fibrotic tissue area, and a faster remodeling process than the SS-electrodes. Western blot analysis showed that rats treated with Cu-DLC-electrode expressed lower levels of NF-κB, caspase-3, and MMP-9 than SS-electrode. This study reveals that the plating of Cu-DLC film on electrode improves the performance of electrosurgical unit.
描述:	碩士指導教授-陳玫秀委員-謝世峯委員-楊良友
資料類型:	thesis
顯示於類別:	[醫療器材產業碩士專班] 博碩士論文

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